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Holonovel 2018

Holonovel Workshop at TIE'18 2018

London, United Kingdom
4 - 5 September 2018
The conference ended on 05 September 2018

Important Dates

Abstract Submission Deadline
15th May 2018
Final Abstract / Full Paper Deadline
15th May 2018

About Holonovel 2018

Holonovels are scenarios based in environments where the physical and virtual merge seamlessly - a possible future of VR/AR and Artificial Intelligence. Papers should include creative contributions that take the form of original narrative fiction, such as science fiction prototypes (SFP), design fiction, scenario based design, or related contributions, to facilitate discussions about the future in a technical, social, ethical or other context. The workshop is part of TIE'18 (The 2nd International Conference on Technology, Innovation, Entrepreneurship and Education), sponsored by the European Alliance for Innovation. Accepted papers will be submitted for publication through Springer USA.

Topics

Virtual reality, Interdisciplinary, The future, Science fiction

Call for Papers

Creative contributions are encouraged that include original narrative fiction, such as science fiction prototypes (SFP), design fiction, scenario based design, or related contributions. The theme takes its inspiration from the Holodeck, spaces in which simulations of people, objects and environments were created and could be interacted with, which appeared in the TV series, Star Trek.

Holonovels are scenarios based in these environments, where the physical and virtual merge seamlessly, facilitating discussions about the future in a technical, social, ethical or other context. The holonovel can be seen as a new medium, to be considered not just by engineers and scientists but also by artists, designers and writers. Contributions that bridge disciplinary boundaries, especially between the arts and sciences, are particularly encouraged.

Accepted papers will be submitted for publication through Springer USA.

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