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CMMP 2019

【Ei indexing】The 6th Int'l Conference on Condensed Matter and Materials Physics (CMMP 2019)

Xi’an, China
20 - 22 August 2019
The conference ended on 22 August 2019

Important Dates

Abstract Submission Deadline
20th August 2019
Abstract Acceptance Notification
20th August 2019
Final Abstract / Full Paper Deadline
20th August 2019

About CMMP 2019

The 6th Int'l Conference on Condensed Matter and Materials Physics (CMMP 2019) will be held from August 20-22, 2019 in Xi'an, China. This Conference will cover issues on Condensed Matter and Materials Physics.

Call for Papers

Brittle fracture Computational physics of material Computer Simulation in Soft Matter Crystal Physics Deformation experiments Dielectrics Electronic Structure & Phonons Energy Materials Functional Phase Transition Physics Graphene and carbon physics Hardening mechanisms Intermetallic Alloys and their Surfaces: Structure, Properties and Applications Liquid Crystals Liquids and Complex Fluids Liquids, Glasses & Amorphous Systems Local Structures of Functional Materials Low temperature physics Magnetism and spintronics Materials for energy Materials physics Matter under Extreme Conditions Metamaterials Metamaterials, photonics and plasmonic Microscopic processes of plastic deformation Nanomagnetism  Nano-materials Nanoscale physics and technology Nanoscale Physics at Low Temperatures Neutron Spectroscopy Nonlinear Dynamics Complexity and Synchronization Novel Materials Phase Transitions Polymer Physics Quantum Fluids and Solids Quantum Gases Quantum Interfaces Semiconductor physics and devices Soft condensed matter and biophysics Solid State Physics Statistical physics Strongly correlated systems Structural Studies of Nanomaterial Structure physics Surfaces, Interfaces and Thin Films Theory of condensed matter

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